About The TU3
The TU3 is a thermal test head for semiconductor validation that combines Mikros' patented high-performance microchannel cooling with embedded heaters, precision fluid controls, and full mechanical gimbaling to provide tight temperature control of chips during their various stages of testing.
Optimization For Test
Originally designed to retrofit into existing automated test equipment (ATE), the TU3 thermal control technology can be customized to a wide variety of test setups. The TU3 provides the highest cooling capacity and fastest thermal transients available on the market today.
Key Features
- High cooling capacity using microchannel flow paths
- Fast thermal transients using integrated heater designs
- Easy serviceability with quick disconnect hoses
- Removable cold plates for new processors
- User interface for easy performance tracking
- Durability tested to 1 million insertions
System Performance
- Cooling Capacity 50W/C-cm2 (for 800W-1kW processors)
- Thermal Transient 80 degrees C drop in < 2 sec
- Temp Range -20 degree C – 105 degree C
- Software Interface ## Test Head Thermal Recipes
- Data Logging Automatic and manual tracking of thermal data
- Control Modes DUT Temp Control & Cold Plate Temp Control
- Compliance X-Y: 1mm, Tilt: 5 degree from horizonal
TU3 Images
Thermal Head (Front)
Controller
Thermal Head (Back)
AC Requirements
- 120-240 VAC, Single Phase
Pressure/Flow
- Chiller with Pump Capable of 1.2 LPM @ 40 PSI
Customization
- Communication
- USB Serial Analog 10
- Adaptable to a Wide Variety of Handlers
Download Data Sheet:
If you would like a PDF version of our datasheet for further analysis or to send along to your team, follow the link below
